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cypress semiconductor corporation ? 198 champion court ? san jose , ca 95134-1709 ? 408-943-2600 document number: 001-08402 rev. *f revised march 11, 2009 cy62136fv30 mobl ? 2 mbit (128k x 16) static ram features very high speed: 45 ns temperature ranges ? industrial: ?40c to +85c ? automotive-a: ?40c to +85c ? automotive-e: ?40c to +125c wide voltage range: 2.20v to 3.60v pin compatible with cy62136v, cy62136cv30/cv33, and cy62136ev30 ultra low standby power ? typical standby current: 1 a ? maximum standby current: 5 a (industrial) ultra low active power ? typical active current: 1.6 ma at f = 1 mhz (45 ns speed) easy memory expansion with ce and oe features automatic power down when deselected cmos for optimum speed and power available in pb-free 48-ball vfbga and 44-pin tsop ii packages functional description the cy62136fv30 is a high pe rformance cmos static ram organized as 128k words by 16 bits. this device features advanced circuit design to provide ultra low active current. this is ideal for providing more battery life? (mobl ? ) in portable applications such as cellular telephones. the device also has an automatic power down feature th at significantly reduces power consumption by 90 percent wh en addresses are not toggling. placing the device into standby mode reduces power consumption by more than 99 percent when deselected (ce high). the input a nd output pins (i/o 0 through i/o 15 ) are placed in a high impedance state when: deselected (ce high) outputs are disabled (oe high) both byte high enable and byte low enable are disabled (bhe , ble high) write operation is active (ce low and we low) write to the device by taking chip enable (ce ) and write enable (we ) inputs low. if byte low enable (ble ) is low, then data from i/o pins (i/o 0 through i/o 7 ) is written into the location specified on the address pins (a 0 through a 16 ). if byte high enable (bhe ) is low, then data from i/o pins (i/o 8 through i/o 15 ) is written into the location specified on the address pins (a 0 through a 16 ). read from the device by taking chip enable (ce ) and output enable (oe ) low while forcing the write enable (we ) high. if byte low enable (ble ) is low, then data from the memory location specified by the address pins appears on i/o 0 to i/o 7 . if byte high enable (bhe ) is low, then data from memory appears on i/o 8 to i/o 15 . see the ?truth table? on page 9 for a complete description of read and write modes. for best practice recommendations, refer to the cypress appli- cation note an1064, sram system guidelines. 128k x 16 ram array i/o 0 ?i/o 7 row decoder a 8 a 7 a 6 a 5 a 2 column decoder a 11 a 12 a 13 a 14 a 15 sense amps data in drivers oe a 4 a 3 i/o 8 ?i/o 15 ce we bhe a 16 a 0 a 1 a 9 a 10 ble logic block diagram [+] feedback
cy62136fv30 mobl ? document number: 001-08402 rev. *f page 2 of 12 product portfolio product range v cc range (v) speed (ns) power dissipation operating i cc (ma) standby i sb2 ( a) f = 1 mhz f = f max min typ [1] max typ [1] max typ [1] max typ [1] max cy62136fv30ll industrial/auto-a 2.2 3.0 3.6 45 1.6 2.5 13 18 1 5 auto-e 2.2 3.0 3.6 55 2 3 15 25 1 20 pin configuration figure 1. 48-ball vfbga pinout [2, 3] figure 2. 44-pin tsop ii [2] we a 11 a 10 a 6 a 0 a 3 ce io 10 io 8 io 9 a 4 a 5 io 11 io 13 io 12 io 14 io 15 v ss a 9 a 8 oe a 7 io 0 bhe nc nc a 2 a 1 ble io 2 io 1 io 3 io 4 io 5 io 6 io 7 a 15 a 14 a 13 a 12 nc nc nc 3 26 5 4 1 d e b a c f g h a 16 nc v cc v cc v ss 1 2 3 4 5 6 7 8 9 11 14 31 32 36 35 34 33 37 40 39 38 12 13 41 44 43 42 16 15 29 30 a 5 18 17 20 19 27 28 25 26 22 21 23 24 a 6 a 7 a 4 a 3 a 2 a 1 a 0 a 14 a 15 a 8 a 9 a 10 a 11 a 12 a 13 nc oe bhe ble ce we io 0 io 1 io 2 io 3 io 4 io 5 io 6 io 7 io 8 io 9 io 10 io 11 io 12 io 13 io 14 io 15 v cc v cc v ss v ss nc 10 a 16 notes 1. typical values are included for reference only and are no t guaranteed or tested. typical values are measured at v cc = v cc(typ) , t a = 25c. 2. nc pins are not connected on the die. 3. pins d3, h1, g2, and h6 in the vfbga package are address exp ansion pins for 4 mb, 8 mb, 16 mb, and 32 mb, respectively. [+] feedback
cy62136fv30 mobl ? document number: 001-08402 rev. *f page 3 of 12 maximum ratings exceeding the maximum ratings may impair the useful life of the device. these user guidelines are not tested. storage temperature ................................ ?65c to + 150c ambient temperature with power applied .......................... ................ ?55c to + 125c supply voltage to ground potential ............................. ?0.3v to 3.9v (v cc(max) + 0.3v) dc voltage applied to outputs in high z state [4, 5] .............. ?0.3v to 3.9v (v cc(max) + 0.3v) dc input voltage [4, 5] .......... ?0.3v to 3.9v (v cc(max) + 0.3v) output current into outputs (l ow) ............................ 20 ma static discharge voltage ......... .............. .............. .... > 2001v (mil-std-883, method 3015) latch up current .................................................... > 200 ma operating range device range ambient temperature v cc [6] cy62136fv30ll ind?l/auto-a ?40c to +85c 2.2v to 3.6v auto-e ?40c to +125c electrical characteristics over the operating range parameter description test conditions -45 (industrial/auto-a) -55 (auto-e) unit min typ [1] max min typ [1] max v oh output high voltage 2.2 < v cc < 2.7 i oh = ?0.1 ma 2.0 2.0 v 2.7 < v cc < 3.6 i oh = ?1.0 ma 2.4 2.4 v v ol output low voltage 2.2 < v cc < 2.7 i ol = 0.1 ma 0.4 0.4 v 2.7 < v cc < 3.6 i ol = 2.1ma 0.4 0.4 v v ih input high voltage 2.2 < v cc < 2.7 1.8 v cc + 0.3 1.8 v cc + 0.3 v 2.7 < v cc < 3.6 2.2 v cc + 0.3 2.2 v cc + 0.3 v v il input low voltage 2.2 < v cc < 2.7 ?0.3 0.6 ?0.3 0.6 v 2.7 < v cc < 3.6 ?0.3 0.8 ?0.3 0.8 v i ix input leakage current gnd < v i < v cc ?1 +1 ?4 +4 a i oz output leakage current gnd < v o < v cc , output disabled ?1 +1 ?4 +4 a i cc v cc operating supply current f = f max = 1/t rc v cc = v ccmax i out = 0 ma cmos levels 13 18 15 25 ma f = 1 mhz 1.6 2.5 2 3 i sb1 automatic ce power down current ? cmos inputs ce > v cc ? 0.2v, v in > v cc ? 0.2v, v in < 0.2v, f = f max (address and data only), f = 0 (oe , we , bhe , and ble ), v cc = 3.60v 15 120 a i sb2 [7] automatic ce power down current ? cmos inputs ce > v cc ? 0.2v, v in > v cc ? 0.2v or v in < 0.2v, f = 0, v cc = 3.60v 15 120 a capacitance tested initially and after any design or proce ss changes that may affect these parameters. parameter description test conditions max unit c in input capacitance t a = 25c, f = 1 mhz, v cc = v cc(typ) 10 pf c out output capacitance 10 pf notes 4. v il(min) = ?2.0v for pulse durations less than 20 ns. 5. v ih(max) =v cc +0.75v for pulse durations less than 20 ns. 6. full device ac operation assumes a minimum of 100 s ramp time from 0 to v cc (min) and 200 s wait time after v cc stabilization. 7. only chip enable (ce ) and byte enables (bhe and ble ) are tied to cmos levels to meet the i sb2 / i ccdr specification. other inputs can be left floating. [+] feedback
cy62136fv30 mobl ? document number: 001-08402 rev. *f page 4 of 12 thermal resistance tested initially and after any design or process changes that may affect these parameters . parameter description test conditions vfbga tsop ii unit ja thermal resistance (junction to ambient) still air, soldered on a 3 4.5 inch, two layer printed circuit board 75 77 c/w jc thermal resistance (junction to case) 10 13 c/w figure 3. ac test loads and waveforms parameters 2.5v (2.2v to 2.7v) 3.0v (2.7v to 3.6v) unit r1 16667 1103 r2 15385 1554 r th 8000 645 v th 1.20 1.75 v data retention characteristics over the operating range parameter description conditions min typ [1] max unit v dr v cc for data retention 1.5 v i ccdr [7] data retention current v cc = 1.5v, ce > v cc - 0.2v, v in > v cc - 0.2v or v in < 0.2v industrial/auto-a 4 a auto-e 12 t cdr [8] chip deselect to data retention time 0 ns t r [9] operation recovery time t rc ns figure 4. data retention waveform [10] v cc v cc output r2 30 pf gnd 90% 10% 90% 10% rise time = 1 v/ns fall time = 1 v/ns output equivalent to: thvenin equivalent all input pulses r th r1 v including jig and scope v cc(min) v cc(min) t cdr v dr > 1.5v data retention mode t r v cc ce or bhe .ble notes 8. tested initially and after any design or process changes that may affect these parameters. 9. full device operation requires linear v cc ramp from v dr to v cc(min) > 100 s or stable at v cc(min) > 100 s. 10. bhe .ble is the and of both bhe and ble . deselect the chip by either disabling ch ip enable signals or by disabling both bhe and ble . [+] feedback
cy62136fv30 mobl ? document number: 001-08402 rev. *f page 5 of 12 switching characteristics over the operating range [11, 12] parameter description -45 (industrial/auto-a) -55 (auto-e) unit min max min max read cycle t rc read cycle time 45 55 ns t aa address to data valid 45 55 ns t oha data hold from address change 10 10 ns t ace ce low to data valid 45 55 ns t doe oe low to data valid 22 25 ns t lzoe oe low to low z [13] 55ns t hzoe oe high to high z [13, 14] 18 20 ns t lzce ce low to low z [13] 10 10 ns t hzce ce high to high z [13, 14] 18 20 ns t pu ce low to power up 00ns t pd ce high to power down 45 55 ns t dbe ble /bhe low to data valid 22 25 ns t lzbe ble /bhe low to low z [13] 55ns t hzbe ble /bhe high to high z [13, 14] 18 20 ns write cycle [15] t wc write cycle time 45 55 ns t sce ce low to write end 35 40 ns t aw address setup to write end 35 40 ns t ha address hold from write end 0 0 ns t sa address setup to write start 0 0 ns t pwe we pulse width 35 40 ns t bw ble /bhe low to write end 35 40 ns t sd data setup to write end 25 25 ns t hd data hold from write end 0 0 ns t hzwe we low to high z [13, 14] 18 20 ns t lzwe we high to low z [13] 10 10 ns notes 11. test conditions for all parameters other than tri-state parame ters assume signal transition time of 3 ns (1v/ns) or less, ti ming reference levels of v cc(typ) /2, input pulse levels of 0 to v cc(typ) , and output loading of the specified i ol /i oh as shown in the ?ac test loads and waveforms? on page 4. 12. ac timing parameters are subject to byte enable signals (bhe or ble ) not switching when chip is dis abled. please see application note an13842 for further clarification 13. at any given temperature and voltage condition, t hzce is less than t lzce , t hzbe is less than t lzbe , t hzoe is less than t lzoe , and t hzwe is less than t lzwe for any given device. 14. t hzoe , t hzce , t hzbe , and t hzwe transitions are measured when the outputs enter a high impedance state. 15. the internal write time of the memory is defined by the overlap of we , ce = v il , bhe and/or ble = v il . all signals are active to initiate a write and any of these signals can terminate a write by going inactive. the data input setup and hold timing are referenced to the edge of the signal that terminates the write. [+] feedback
cy62136fv30 mobl ? document number: 001-08402 rev. *f page 6 of 12 switching waveforms figure 5. read cycle no.1: address transition controlled . [16, 17] figure 6. read cycle no. 2: oe controlled [17, 18] previous data valid data valid t rc t aa t oha address data out 50% 50% data valid t rc t ace t lzbe t lzce t pu high impedance i cc t hzoe t hzce t pd t hzbe t lzoe t dbe t doe impedance high i sb data out oe ce v cc supply current bhe /ble address notes 16. the device is continuously selected. oe , ce = v il , bhe and ble = v il . 17. we is high for read cycle. 18. address valid before or similar to ce and bhe , ble transition low. [+] feedback
cy62136fv30 mobl ? document number: 001-08402 rev. *f page 7 of 12 figure 7. write cycle no 1: we controlled [15, 19, 20] figure 8. write cycle 2: ce controlled [15, 19, 20] switching waveforms (continued) t hd t sd t pwe t sa t ha t aw t wc t hzoe data in note 21 t bw t sce data i/o address ce we oe bhe /ble t hd t sd t pwe t ha t aw t sce t wc t hzoe data in t bw t sa ce address we data i/o oe bhe /ble note 21 notes 19. data io is high impedance if oe = v ih . 20. if ce goes high simultaneously with we = v ih , the output remains in a high impedance state. 21. during this period, the ios are in output state. do not apply input signals. [+] feedback
cy62136fv30 mobl ? document number: 001-08402 rev. *f page 8 of 12 figure 9. write cycle 3: we controlled, oe low [20] figure 10. write cycle 4: bhe /ble controlled, oe low [20] switching waveforms (continued) data in t hd t sd t lzwe t pwe t sa t ha t aw t sce t wc t hzwe t bw note 21 ce address we data i/o bhe /ble t hd t sd t sa t ha t aw t wc data in t bw t sce t pwe t hzwe t lzwe note 21 data i/o address ce we bhe /ble [+] feedback
cy62136fv30 mobl ? document number: 001-08402 rev. *f page 9 of 12 truth table ce we oe bhe ble inputs or outputs mode power hxxxxhigh z deselect or power down standby (i sb ) x x x h h high z deselect or power down standby (i sb ) l h l l l data out (i/o 0 ?i/o 15 )read active (i cc ) lhlhldata out (i/o 0 ?i/o 7 ); i/o 8 ?i/o 15 in high z read active (i cc ) l h l l h data out (i/o 8 ?i/o 15 ); i/o 0 ?i/o 7 in high z read active (i cc ) l h h l l high z output disabled active (i cc ) l h h h l high z output disabled active (i cc ) l h h l h high z output disabled active (i cc ) l l x l l data in (i/o 0 ?i/o 15 ) write active (i cc ) l l x h l data in (i/o 0 ?i/o 7 ); i/o 8 ?i/o 15 in high z write active (i cc ) l l x l h data in (i/o 8 ?i/o 15 ); i/o 0 ?i/o 7 in high z write active (i cc ) [+] feedback
cy62136fv30 mobl ? document number: 001-08402 rev. *f page 10 of 12 ordering information speed (ns) ordering code package diagram package type operating range 45 cy62136fv30ll-45bvxi 51-85150 48-b all vfbga (pb-free) industrial cy62136fv30ll-45zsxi 51-85087 44-pin tsop ii (pb-free) CY62136FV30LL-45ZSXA 51-85087 44-pin tsop ii (pb-free) automotive-a 55 cy62136fv30ll-55zsxe 51-85087 44-pin tsop ii (pb-free) automotive-e contact your local cypress sales represen tative for availability of these parts. package diagrams figure 11. 48-ball vfbga (6 x 8 x 1 mm) a 1 a1 corner 0.75 0.75 ?0.300.05(48x) ?0.25 m c a b ?0.05 m c b a 0.15(4x) 0.210.05 1.00 max c seating plane 0.55 max. 0.25 c 0.10 c a1 corner top view bottom view 2 3 4 3.75 5.25 b c d e f g h 65 46 5 23 1 d h f g e c b a 6.000.10 8.000.10 a 8.000.10 6.000.10 b 1.875 2.625 0.26 max. 51-85150-*d [+] feedback
cy62136fv30 mobl ? document number: 001-08402 rev. *f page 11 of 12 figure 12. 44-pin tsop ii package diagrams (continued) 51-85087-*a [+] feedback
cy62136fv30 mobl ? ? cypress semiconductor corporation, 2006-2009. the information contained herein is subject to change without notice. cypress s emiconductor corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a cypress product. nor does it convey or imply any license under patent or ot her rights. cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreemen t with cypress. furthermore, cypress does not authorize its products for use as critical components in life-support syst ems where a malfunction or failure may reas onably be expected to result in significa nt injury to the user. the inclusion of cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies cypress against all charges. any source code (software and/or firmware) is owned by cypress semiconductor corporation (cypress) and is protected by and subj ect to worldwide patent protection (united states and foreign), united states copyright laws and international treaty provisions. cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the cypress source code and derivative works for the sole purpose of creating custom software and or firmware in su pport of licensee product to be used only in conjunction with a cypress integrated circuit as specified in the applicable agreement. any reproduction, modification, translation, compilation, or repre sentation of this source code except as specified above is prohibited without the express written permission of cypress. disclaimer: cypress makes no warranty of any kind, express or impl ied, with regard to this material, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose. cypress re serves the right to make changes without further notice to t he materials described herein. cypress does not assume any liability arising out of the application or use of any product or circuit described herein. cypress does not authori ze its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. the inclusion of cypress? prod uct in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies cypress against all charges. use may be limited by and subject to the applicable cypress software license agreement. document number: 001-08402 rev. *f revised march 11, 2009 page 12 of 12 mobl is a registered trademark and more battery life is a trademark of cypress semiconductor. all product and company names men tioned in this document are the trademarks of their respective holders . document history page sales, solutions, and legal information worldwide sales and design support cypress maintains a worldwide network of offices, solution center s, manufacturer?s representative s, and distributors. to find t he office closest to you, visit us at cypress.com/sales. products psoc psoc.cypress.com clocks & buffers clocks.cypress.com wireless wireless.cypress.com memories memory.cypress.com image sensors image.cypress.com psoc solutions general psoc.cypress.com/solutions low power/low voltage psoc.cypress.com/low-power precision analog psoc.cypress.com/precision-analog lcd drive psoc.cypress.com/lcd-drive can 2.0b psoc.cypress.com/can usb psoc.cypress.com/usb document title: cy62136fv30 mobl ? 2 mbit (128k x 16) static ram document number: 001-08402 rev. ecn no. submission date orig. of change description of change ** 467351 see ecn nxr new datasheet *a 797956 see ecn vkn converted from preliminary to final changed i sb1(typ) and i sb1(max) specification from 0.5 a to 1.0 a and 2.5 a to 5.0 a, respectively changed i sb2(typ) and i sb2(max) specification from 0.5 a to 1.0 a and 2.5 a to 5.0 a, respectively changed i ccdr(typ) and i ccdr(max) specification from 0.5 a to 1.0 a and 2.5 a to 4.0 a, respectively changed i cc(max) specification from 2.25 a to 2.5 a *b 869500 see ecn vkn added automotive information updated ordering information table added footnote 12 related to t ace *c 901800 see ecn vkn added footnote 9 related to i sb2 and i ccdr made footnote 13 applicable to ac parameters from t ace *d 1371124 see ecn vkn/aesa converted automotive information from pr eliminary to final changed i ix min spec from ?1 a to ?4 a and i ix max spec from +1 a to +4 a changed i oz min spec from ?1 a to ?4 a and i oz max spec from +1 a to +4 a changed t dbe spec from 55 ns to 25 ns for automotive part *e 2594937 10/22/08 nxr/pyrs added automotive-a information changed t lzbe from 10 ns to 5 ns for -55. *f 2675375 03/17/2009 vkn/pyrs corrected typo on page 2 (corrected i sb2 unit to a from ma) [+] feedback

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